Torunbalci, M. M. Et Al. 2021. An all-silicon process platfom for wafer-level vacuum packaged MEMS devices. IEEE Sensors Journal , vol.21, no.13 , 13958-13964.

Torunbalci, M. M., Gavcar, H. D., Yesil, F., Alper, S. E., & AKIN, T., (2021). An all-silicon process platfom for wafer-level vacuum packaged MEMS devices. IEEE Sensors Journal , vol.21, no.13, 13958-13964.

Torunbalci, Mustafa Et Al. "An all-silicon process platfom for wafer-level vacuum packaged MEMS devices," IEEE Sensors Journal , vol.21, no.13, 13958-13964, 2021

Torunbalci, Mustafa M. Et Al. "An all-silicon process platfom for wafer-level vacuum packaged MEMS devices." IEEE Sensors Journal , vol.21, no.13, pp.13958-13964, 2021

Torunbalci, M. M. Et Al. (2021) . "An all-silicon process platfom for wafer-level vacuum packaged MEMS devices." IEEE Sensors Journal , vol.21, no.13, pp.13958-13964.

@article{article, author={Mustafa Mert Torunbalci Et Al. }, title={An all-silicon process platfom for wafer-level vacuum packaged MEMS devices}, journal={IEEE Sensors Journal}, year=2021, pages={13958-13964} }