T. Ogurtani And E. Oren, "A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects," Advanced Metallization Conference (AMC) , California, United States Of America, pp.483-487, 2000
Ogurtani, T. And Oren, E. 2000. A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects. Advanced Metallization Conference (AMC) , (California, United States Of America), 483-487.
Ogurtani, T., & Oren, E., (2000). A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects . Advanced Metallization Conference (AMC) (pp.483-487). California, United States Of America
Ogurtani, TO, And EE Oren. "A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects," Advanced Metallization Conference (AMC), California, United States Of America, 2000
Ogurtani, TO And Oren, EE. "A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects." Advanced Metallization Conference (AMC) , California, United States Of America, pp.483-487, 2000
Ogurtani, T. And Oren, E. (2000) . "A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects." Advanced Metallization Conference (AMC) , California, United States Of America, pp.483-487.
@conferencepaper{conferencepaper, author={TO Ogurtani And author={EE Oren}, title={A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects}, congress name={Advanced Metallization Conference (AMC)}, city={California}, country={United States Of America}, year={2000}, pages={483-487} }