Torunbalci, M. M. Et Al. 2015. Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding. SENSORS AND ACTUATORS A-PHYSICAL , vol.224 , 169-176.

Torunbalci, M. M., Alper, S. E., & AKIN, T., (2015). Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding. SENSORS AND ACTUATORS A-PHYSICAL , vol.224, 169-176.

Torunbalci, Mustafa, Said Emre Alper, And TAYFUN AKIN. "Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding," SENSORS AND ACTUATORS A-PHYSICAL , vol.224, 169-176, 2015

Torunbalci, Mustafa M. Et Al. "Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding." SENSORS AND ACTUATORS A-PHYSICAL , vol.224, pp.169-176, 2015

Torunbalci, M. M. Alper, S. E. And AKIN, T. (2015) . "Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding." SENSORS AND ACTUATORS A-PHYSICAL , vol.224, pp.169-176.

@article{article, author={Mustafa Mert Torunbalci Et Al. }, title={Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding}, journal={SENSORS AND ACTUATORS A-PHYSICAL}, year=2015, pages={169-176} }