Cetintepe, C. Et Al. 2014. A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance. INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES , vol.6 , 473-480.

Cetintepe, C., Topalli, E. S., Demir, Ş., Civi, O. A., & Akın, T., (2014). A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance. INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES , vol.6, 473-480.

Cetintepe, Cagri Et Al. "A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance," INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES , vol.6, 473-480, 2014

Cetintepe, Cagri Et Al. "A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance." INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES , vol.6, pp.473-480, 2014

Cetintepe, C. Et Al. (2014) . "A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance." INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES , vol.6, pp.473-480.

@article{article, author={Cagri Cetintepe Et Al. }, title={A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance}, journal={INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES}, year=2014, pages={473-480} }