T. O. Ogurtani And O. Akyildiz, "Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints," Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting , vol.139, Massachusetts, United States Of America, pp.151-155, 2007
Ogurtani, T. O. And Akyildiz, O. 2007. Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints. Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting , (Massachusetts, United States Of America), 151-155.
Ogurtani, T. O., & Akyildiz, O., (2007). Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints . Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting (pp.151-155). Massachusetts, United States Of America
Ogurtani, Tarik, And Oncu Akyildiz. "Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints," Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting, Massachusetts, United States Of America, 2007
Ogurtani, Tarik O. And Akyildiz, Oncu. "Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints." Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting , Massachusetts, United States Of America, pp.151-155, 2007
Ogurtani, T. O. And Akyildiz, O. (2007) . "Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints." Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting , Massachusetts, United States Of America, pp.151-155.
@conferencepaper{conferencepaper, author={Tarik Omer Ogurtani And author={Oncu Akyildiz}, title={Morphological evolution of intragranular void under the thermal-stress gradient generated by the steady state heat flow in encapsulated metallic films: Special reference to flip chip solder joints}, congress name={Symposium on Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior held at the 2007 MRS Fall Meeting}, city={Massachusetts}, country={United States Of America}, year={2007}, pages={151-155} }