Comart, I. Et Al. 2019. Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.28, no.4 , 724-731.

Comart, I., Cetintepe, C., Sagiroglu, E., DEMİR, Ş., & AKIN, T., (2019). Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.28, no.4, 724-731.

Comart, Ilker Et Al. "Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches," JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.28, no.4, 724-731, 2019

Comart, Ilker Et Al. "Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches." JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.28, no.4, pp.724-731, 2019

Comart, I. Et Al. (2019) . "Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches." JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.28, no.4, pp.724-731.

@article{article, author={Ilker Comart Et Al. }, title={Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches}, journal={JOURNAL OF MICROELECTROMECHANICAL SYSTEMS}, year=2019, pages={724-731} }