m. zolfaghari borra Et Al. , "Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching," Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC) , Munich, Germany, 2019
zolfaghari borra, m. Et Al. 2019. Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching. Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC) , (Munich, Germany).
zolfaghari borra, m., Nasser, H., ÇİFTPINAR, E. H., turnalı, a., deminsky, p., Çolakoğlu, T., ... TOKEL, O.(2019). Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching . Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC), Munich, Germany
zolfaghari borra, mona Et Al. "Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching," Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC), Munich, Germany, 2019
zolfaghari borra, mona z. Et Al. "Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching." Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC) , Munich, Germany, 2019
zolfaghari borra, m. Et Al. (2019) . "Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching." Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC) , Munich, Germany.
@conferencepaper{conferencepaper, author={mona zolfaghari borra Et Al. }, title={Slicing Crystalline Silicon Wafer by Deep Subsurface Laser Processing and Selective Chemical Etching}, congress name={Conference on Lasers and Electro-Optics Europe / European Quantum Electronics Conference (CLEO/Europe-EQEC)}, city={Munich}, country={Germany}, year={2019}}