T. Ogurtani And E. Oren, "Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures," JOURNAL OF APPLIED PHYSICS , vol.96, no.12, pp.7246-7253, 2004
Ogurtani, T. And Oren, E. 2004. Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures. JOURNAL OF APPLIED PHYSICS , vol.96, no.12 , 7246-7253.
Ogurtani, T., & Oren, E., (2004). Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures. JOURNAL OF APPLIED PHYSICS , vol.96, no.12, 7246-7253.
Ogurtani, TO, And EE Oren. "Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures," JOURNAL OF APPLIED PHYSICS , vol.96, no.12, 7246-7253, 2004
Ogurtani, TO And Oren, EE. "Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures." JOURNAL OF APPLIED PHYSICS , vol.96, no.12, pp.7246-7253, 2004
Ogurtani, T. And Oren, E. (2004) . "Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures." JOURNAL OF APPLIED PHYSICS , vol.96, no.12, pp.7246-7253.
@article{article, author={TO Ogurtani And author={EE Oren}, title={Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures}, journal={JOURNAL OF APPLIED PHYSICS}, year=2004, pages={7246-7253} }