Huang, Y. Et Al. 2003. Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique. IEEE International Ultrasonics Symposium , (Hawaii, United States Of America), 1161-1164.

Huang, Y., Haeggstrom, E., BAYRAM, B., Zhuang, X., Ergun, A., Cheng, C., ... Khuri-Yakub, B.(2003). Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique . IEEE International Ultrasonics Symposium (pp.1161-1164). Hawaii, United States Of America

Huang, Y Et Al. "Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique," IEEE International Ultrasonics Symposium, Hawaii, United States Of America, 2003

Huang, Y Et Al. "Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique." IEEE International Ultrasonics Symposium , Hawaii, United States Of America, pp.1161-1164, 2003

Huang, Y. Et Al. (2003) . "Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique." IEEE International Ultrasonics Symposium , Hawaii, United States Of America, pp.1161-1164.

@conferencepaper{conferencepaper, author={Y Huang Et Al. }, title={Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique}, congress name={IEEE International Ultrasonics Symposium}, city={Hawaii}, country={United States Of America}, year={2003}, pages={1161-1164} }