Demirhan Aydin, G. Et Al. 2024. Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors. Micromachines , vol.15, no.8 .

Demirhan Aydin, G., Akar, O. S., & AKIN, T., (2024). Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors. Micromachines , vol.15, no.8.

Demirhan Aydin, Gulsah, ORHAN ŞEVKET AKAR, And TAYFUN AKIN. "Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors," Micromachines , vol.15, no.8, 2024

Demirhan Aydin, Gulsah D. Et Al. "Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors." Micromachines , vol.15, no.8, 2024

Demirhan Aydin, G. Akar, O. S. And AKIN, T. (2024) . "Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors." Micromachines , vol.15, no.8.

@article{article, author={Gulsah Demirhan Aydin Et Al. }, title={Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors}, journal={Micromachines}, year=2024}