Comart, I. Et Al. 2014. Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding. IEEE SENSORS JOURNAL , vol.14, no.6 , 2006-2011.

Comart, I., Topalli, K., DEMİR, Ş., & AKIN, T., (2014). Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding. IEEE SENSORS JOURNAL , vol.14, no.6, 2006-2011.

Comart, Ilker Et Al. "Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding," IEEE SENSORS JOURNAL , vol.14, no.6, 2006-2011, 2014

Comart, Ilker Et Al. "Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding." IEEE SENSORS JOURNAL , vol.14, no.6, pp.2006-2011, 2014

Comart, I. Et Al. (2014) . "Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding." IEEE SENSORS JOURNAL , vol.14, no.6, pp.2006-2011.

@article{article, author={Ilker Comart Et Al. }, title={Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding}, journal={IEEE SENSORS JOURNAL}, year=2014, pages={2006-2011} }