Temel, O. Et Al. 2021. Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.30, no.1 , 64-71.

Temel, O., KALAY, Y. E., & AKIN, T., (2021). Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.30, no.1, 64-71.

Temel, Oguzhan, YUNUS EREN KALAY, And TAYFUN AKIN. "Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation," JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.30, no.1, 64-71, 2021

Temel, Oguzhan Et Al. "Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation." JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.30, no.1, pp.64-71, 2021

Temel, O. KALAY, Y. E. And AKIN, T. (2021) . "Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation." JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , vol.30, no.1, pp.64-71.

@article{article, author={Oguzhan Temel Et Al. }, title={Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation}, journal={JOURNAL OF MICROELECTROMECHANICAL SYSTEMS}, year=2021, pages={64-71} }