Hoque, M. J. Et Al. 2021. Modular Heat Sinks for Enhanced Thermal Management of Electronics. JOURNAL OF ELECTRONIC PACKAGING , vol.143, no.2 .

Hoque, M. J., Gunay, A. A., Stillwell, A., Gurumukhi, Y., Pilawa-Podgurski, R. C. N., & Miljkovic, N., (2021). Modular Heat Sinks for Enhanced Thermal Management of Electronics. JOURNAL OF ELECTRONIC PACKAGING , vol.143, no.2.

Hoque, Muhammad Et Al. "Modular Heat Sinks for Enhanced Thermal Management of Electronics," JOURNAL OF ELECTRONIC PACKAGING , vol.143, no.2, 2021

Hoque, Muhammad J. Et Al. "Modular Heat Sinks for Enhanced Thermal Management of Electronics." JOURNAL OF ELECTRONIC PACKAGING , vol.143, no.2, 2021

Hoque, M. J. Et Al. (2021) . "Modular Heat Sinks for Enhanced Thermal Management of Electronics." JOURNAL OF ELECTRONIC PACKAGING , vol.143, no.2.

@article{article, author={Muhammad Jahidul Hoque Et Al. }, title={Modular Heat Sinks for Enhanced Thermal Management of Electronics}, journal={JOURNAL OF ELECTRONIC PACKAGING}, year=2021}