Torunbalci, M. M. Et Al. 2015. A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process. JOURNAL OF MICROMECHANICS AND MICROENGINEERING , vol.25 .

Torunbalci, M. M., Alper, S. E., & Akın, T., (2015). A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process. JOURNAL OF MICROMECHANICS AND MICROENGINEERING , vol.25.

Torunbalci, Mustafa, Said Emre Alper, And TAYFUN AKIN. "A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process," JOURNAL OF MICROMECHANICS AND MICROENGINEERING , vol.25, 2015

Torunbalci, Mustafa M. Et Al. "A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process." JOURNAL OF MICROMECHANICS AND MICROENGINEERING , vol.25, 2015

Torunbalci, M. M. Alper, S. E. And Akın, T. (2015) . "A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process." JOURNAL OF MICROMECHANICS AND MICROENGINEERING , vol.25.

@article{article, author={Mustafa Mert Torunbalci Et Al. }, title={A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process}, journal={JOURNAL OF MICROMECHANICS AND MICROENGINEERING}, year=2015}