Citation Formats
Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory
  • IEEE
  • ACM
  • APA
  • Chicago
  • MLA
  • Harvard
  • BibTeX

T. O. Ogurtani And O. Akyildiz, "Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory," JOURNAL OF APPLIED PHYSICS , vol.104, no.2, 2008

Ogurtani, T. O. And Akyildiz, O. 2008. Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory. JOURNAL OF APPLIED PHYSICS , vol.104, no.2 .

Ogurtani, T. O., & Akyildiz, O., (2008). Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory. JOURNAL OF APPLIED PHYSICS , vol.104, no.2.

Ogurtani, Tarik, And Oncu Akyildiz. "Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory," JOURNAL OF APPLIED PHYSICS , vol.104, no.2, 2008

Ogurtani, Tarik O. And Akyildiz, Oncu. "Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory." JOURNAL OF APPLIED PHYSICS , vol.104, no.2, 2008

Ogurtani, T. O. And Akyildiz, O. (2008) . "Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory." JOURNAL OF APPLIED PHYSICS , vol.104, no.2.

@article{article, author={Tarik Omer Ogurtani And author={Oncu Akyildiz}, title={Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory}, journal={JOURNAL OF APPLIED PHYSICS}, year=2008}