Karatoprak, F. Et Al. 2023. A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling. EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) , (California, United States Of America), 1-3.

Karatoprak, F., Saçın, E. S., Özese, D., Durgun, A. C., Baydoğan, M. G., Aygün, K., ... Memioğlu, T.(2023). A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling . EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (pp.1-3). California, United States Of America

Karatoprak, Furkan Et Al. "A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling," EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), California, United States Of America, 2023

Karatoprak, Furkan Et Al. "A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling." EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) , California, United States Of America, pp.1-3, 2023

Karatoprak, F. Et Al. (2023) . "A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling." EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) , California, United States Of America, pp.1-3.

@conferencepaper{conferencepaper, author={Furkan Karatoprak Et Al. }, title={A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling}, congress name={EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)}, city={California}, country={United States Of America}, year={2023}, pages={1-3} }