T. Ogurtani And O. Akyildiz, "Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces," JOURNAL OF APPLIED PHYSICS , vol.97, no.9, 2005
Ogurtani, T. And Akyildiz, O. 2005. Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces. JOURNAL OF APPLIED PHYSICS , vol.97, no.9 .
Ogurtani, T., & Akyildiz, O., (2005). Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces. JOURNAL OF APPLIED PHYSICS , vol.97, no.9.
Ogurtani, TO, And O Akyildiz. "Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces," JOURNAL OF APPLIED PHYSICS , vol.97, no.9, 2005
Ogurtani, TO And Akyildiz, O. "Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces." JOURNAL OF APPLIED PHYSICS , vol.97, no.9, 2005
Ogurtani, T. And Akyildiz, O. (2005) . "Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces." JOURNAL OF APPLIED PHYSICS , vol.97, no.9.
@article{article, author={TO Ogurtani And author={O Akyildiz}, title={Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces}, journal={JOURNAL OF APPLIED PHYSICS}, year=2005}