DEMIR, E. C. Et Al. 2014. Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices. IEEE 16th Electronics Packaging Technology Conference (EPTC) , (Marina Bay Sands, Singapore), 241-245.

DEMIR, E. C., TORUNBALCI, M. M., DONMEZ, I., KALAY, Y. E., & AKIN, T., (2014). Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices . IEEE 16th Electronics Packaging Technology Conference (EPTC) (pp.241-245). Marina Bay Sands, Singapore

DEMIR, Eyup Et Al. "Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices," IEEE 16th Electronics Packaging Technology Conference (EPTC), Marina Bay Sands, Singapore, 2014

DEMIR, Eyup C. Et Al. "Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices." IEEE 16th Electronics Packaging Technology Conference (EPTC) , Marina Bay Sands, Singapore, pp.241-245, 2014

DEMIR, E. C. Et Al. (2014) . "Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices." IEEE 16th Electronics Packaging Technology Conference (EPTC) , Marina Bay Sands, Singapore, pp.241-245.

@conferencepaper{conferencepaper, author={Eyup Can DEMIR Et Al. }, title={Fabrication and Characterization of Gold-Tin Eutectic Bonding for Hermetic Packaging of MEMS Devices}, congress name={IEEE 16th Electronics Packaging Technology Conference (EPTC)}, city={Marina Bay Sands}, country={Singapore}, year={2014}, pages={241-245} }