Soydan, A. K. Et Al. 2019. Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration. 18th IEEE Sensors Conference , (Montreal, Canada).

Soydan, A. K., Yüksel, M. B., Işık Akçakaya, D., & KÜLAH, H., (2019). Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration . 18th IEEE Sensors Conference, Montreal, Canada

Soydan, Alper Et Al. "Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration," 18th IEEE Sensors Conference, Montreal, Canada, 2019

Soydan, Alper K. Et Al. "Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration." 18th IEEE Sensors Conference , Montreal, Canada, 2019

Soydan, A. K. Et Al. (2019) . "Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration." 18th IEEE Sensors Conference , Montreal, Canada.

@conferencepaper{conferencepaper, author={Alper Kaan Soydan Et Al. }, title={Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration}, congress name={18th IEEE Sensors Conference}, city={Montreal}, country={Canada}, year={2019}}