Özese, D. Et Al. 2024. Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis. 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , (Toronto, Canada).

Özese, D., Baydoǧan, M. G., DURGUN, A. C., & Aygün, K., (2024). Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis . 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Toronto, Canada

Özese, Doǧanay Et Al. "Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis," 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Toronto, Canada, 2024

Özese, Doǧanay Et Al. "Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis." 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , Toronto, Canada, 2024

Özese, D. Et Al. (2024) . "Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis." 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , Toronto, Canada.

@conferencepaper{conferencepaper, author={Doǧanay Özese Et Al. }, title={Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis}, congress name={33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024}, city={Toronto}, country={Canada}, year={2024}}