Can, U. I. And BAYRAM, B. 2014. Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum. DIAMOND AND RELATED MATERIALS , vol.47 , 53-57.

Can, U. I., & BAYRAM, B., (2014). Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum. DIAMOND AND RELATED MATERIALS , vol.47, 53-57.

Can, Uryan, And BARIŞ BAYRAM. "Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum," DIAMOND AND RELATED MATERIALS , vol.47, 53-57, 2014

Can, Uryan I. And BAYRAM, BARIŞ. "Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum." DIAMOND AND RELATED MATERIALS , vol.47, pp.53-57, 2014

Can, U. I. And BAYRAM, B. (2014) . "Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum." DIAMOND AND RELATED MATERIALS , vol.47, pp.53-57.

@article{article, author={Uryan Isik Can And author={BARIŞ BAYRAM}, title={Plasma-activated direct bonding of patterned silicon-on-insulator wafers to diamond-coated wafers under vacuum}, journal={DIAMOND AND RELATED MATERIALS}, year=2014, pages={53-57} }